The case of the product is largely divided into two types: a plastic resin encapsulation type and an airtight encapsulation type made of metal.
Recently, inexpensive and highly productive plastic resin bags have become the mainstream, and the application area is expanding from small signals to large electricity.
This is due to the development of resin with high mechanical strength, excellent electrical insulation, and environmental resistance, and the development of molding technology or surface treatment technology, which enables rapid reliability improvement.
Although it is due to the market environment in terms of phenomenon, it is possible to realize the same level of reliability as a metal airtight encapsulation type except for a special environment.
However, since the plastic resin type is not an airtight encapsulation type, moisture penetrates through the resin, so if the environment in which the device or system is intended to be used is predictable in advance, it is recommended to use a metal airtight encapsulation type.
When semiconductor products are directly exposed to an atmosphere such as dust, harmful gases, salt, and radiation, they are the main causes of property instability, deterioration, and corrosion of the lead area, so it is necessary to be careful.